Listing typeSupply Product
Record ID950000303
StatusPublished
Product description
12-inch FOUP omnidirectional semiconductor embodied robot, which addresses the automated handling of carriers such as wafer cassettes in the wafer manufacturing processes of semiconductors. Specifically developed for the semiconductor industry, the composite robot uses a collaborative robotic arm to handle common types of carriers in wafer manufacturing, such as FOUP, FOSB, and BOX, completing the transportation and loading/unloading of wafers.
Specifications
| Product model | LINK-OWD-SRA-C-FOUP-12 |
|---|---|
| Max. Speed | 1.5 m/s |
| Duration | 8 Hours |
| Payload | 20kg |
| Dimensions | 1146*646*1222mm |
| Rotating Radius | 625mm |
| 驱动形式 | Differential drive / omnidirectional platform as stated on official product category |
| 导航方式 | High-precision SLAM navigation |
| 通信协议 | Standard electrical interfaces and communication protocols |
Specifications
Drive configurationDifferential drive / omnidirectional platform as stated on official product category
Navigation methodHigh-precision SLAM navigation
Rated payload20kg
Maximum speed1.5 m/s
Product modelLINK-OWD-SRA-C-FOUP-12
Typical runtime8 Hours
Communication protocolStandard electrical interfaces and communication protocols
Dimensions1146*646*1222mm